TM300-1 is a coefficient of thermal conductivity is 3.0 W/m.K, one-part mud of thermal conductivity, plasticity is very strong, the application process can be made according to the customer demand to high compression rate sheet products or half flow state, meet the automatic glue process as efficient thermal effect and excellent gap filling effect, mainly used in low pressure and the demand for silicon volatile situations.
Thermal Conductivity：3.0W/m.k
Low volatility
Very low interfacial thermal resistance
Low installation stress
Normal temperature storage
Security equipment
Optical applications such as optical modules
Network communication equipment
High-speed large storage drive
Car engine control unit
Attribute | Value | Test Method |
Color | Blue | Visual |
Density(g/cc) | 2.9 | ASTM D792 |
Extrusion rate (g/min) | 1.5~3.5 | 0.4MPa/14g needle |
Weight Damnify (%) | ＜1.0 | 125℃/48H |
Usage Temperature(°C) | -60~200 | / |
Flammability | V-0 | UL 94 |
Shelf Life（Month） | 6 | Temperature < 40 ℃ to avoid extrusion, exposure |
Electrical | ||
Breakdown Voltage (kV/mm) | ＞5.0 | ASTM D149 |
Volume Resistivity (Ω.cm) | 1014 | ASTM D257 |
Thermal | ||
Thermal Conductivity(W/m.K) | 3.0 | ISO 22007-2 |
Thermal Resistance（℃*in2/W）@50psi, 0.3mm | ＜0.31 | ASTM D5470 |
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