TM200-L is a thermal conductivity of 2.0W/m.K, one-component low-volatility thermally conductive mud, with strong plasticity. The application process can be made into sheet products with high compressibility or semi-fluid state to meet the requirements of customers. The dispensing process has efficient thermal conductivity and excellent gap filling effect, and is mainly used in applications with low pressure and demand for silicon volatilization.
Thermal Conductivity：2.0W/m.k
Low volatility
Very low interfacial thermal resistance
Low installation stress
Normal temperature storage
Security equipment
Optical applications such as optical modules
Network communication equipment
High-speed large storage drive
Car engine control unit
Attribute | Value | Test Method |
Color | White | Visual |
Density(g/cc) | 2.8 | ASTM D792 |
Extrusion Rate (g/s) | ＞6 | ISO9048 |
Low molecular Siloxane Content (D3~D10, ppm) | ＜50 | ASTM F2466-10 |
Usage Temperature(°C) | -60~200 | / |
Flammability | V-0 | UL 94 |
Shelf Life（Month） | 6 | Temperature < 40 ℃ to avoid extrusion, exposure |
Electrical | ||
Breakdown Voltage (kV/mm) | ＞5.0 | ASTM D149 |
Volume Resistivity (Ω.cm) | 1012 | ASTM D257 |
Thermal | ||
Thermal Conductivity(W/m.K) | 2.0 | ISO 22007-2 |
Thermal Resistance （℃*in2/W）@50psi，0.3mm | ＜0.56 | ASTM D5470 |
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