With superior conformability, AOK gap fillers bridge uneven surfaces and eliminate air gaps, delivering reliable thermal management in densely packed electronic assemblies.
TF200-K is a two-part 1:1 mixed and cured thermally conductive gel. It can be cured at room temperature, and can also be heated and cured according to customer needs. The thermal conductivity after cu...
TF300 is a two-part 1:1 mixed-curing thermally conductive gel. It can be cured at room temperature. And be cured by heating (80℃) according to customer needs. The thermal conductivity after curing is...
TF350 - L is a low volatile organic silicon thermal conductive adhesive, coefficient of thermal conductivity is 3.5W/(m·K), divided into components of AB, mix according to 1:1, room temperature cur...
TF400 is a two-part 1:1 mixed curing heat conduction gel, room temperature curing, and also can be used according to the customer need to heat curing (80 ℃), coefficient of thermal conductivity is 4....
TF600 is a two-part 1:1 mixed curing thermal conductive gel. The client is formed and cured at room temperature. It can also be heated and cured according to the customer's use needs. After curing...
TF 800 is a high thermal conductivity, two-part, 1:1 ratio, ceramic filled silicone dispensable gap filler. Curing at room temperature lends itself to high volume automation. Typical applications ar...
TF1000 is a two-part 1:1 mixed curing thermal liquid gap filler. Can be formed and cured at room temperature. It can also be heated and cured according to the customer's use needs. After curing, t...
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