TG600-M is an ultra-low thermal resistance thermal grease that features both low Bond Line Thickness (BLT) resistance and high thermal conductivity. It effectively minimizes contact thermal resistance between heat sinks and heat sources, meeting current and future thermal management demands. This high-thermal-conductivity grease has been successfully used in temperature-sensitive components including CPUs, GPUs, and PLCs.
Thermal Conductivity: 6.0W/(m·K)
Contains metallic filler particles
Low Bleed Resistance
Excellent Long-Term Reliability
Interfacial Wetting: Effective thermal resistance reduction
IT - Notebooks, Servers, Storage Modules
Network Communication Equipment - Wireless Modules, Routers
Consumer Electronics - Gaming Systems, Portable Devices
Industrial Control Equipment
Power Supplies
High-power LED Lighting
Attribute | Value | Test Method |
Color | Grey | Visual |
Density(g/cc) | 2.6 | ASTM D792 |
Volatile Content(%) | ≤0.5 | @150℃/24h |
Viscosity(cP) | 386000 | DV2T-T96-12Rpm |
Cone Penetration(0.1mm @25℃) | 253 | GB/T269 |
Usage Temperature(°C) | -40~150 | / |
Shelf Life(months) | 12 | Temperature<40℃ avoid extrusion and exposure to the sun |
Thermal | ||
Thermal Conductivity(W/(m·K)) | 6.0 | ISO 22007-2 |
Thermal Resistance (℃·in2/W @50psi,80℃) | ≤0.008 | ASTM D5470 |
+86 755 2976 5899 
English 
