TG500 is a high-Performance thermal greas that does not contain metal thermal fillers. Delivers exceptional thermal stability, long-term reliability, and ultra-low bond line thickness (BLT) for minimized interfacial thermal resistance between heat sources and sinks. Engineered for temperature-critical components requiring uncompromised reliability: High-performance CPUs/GPUs, Industrial PLC modules, Precision thermal management systems.
6.0W/(m·K)
Non-metallic Filler Formulation, Excellent Electrical Insulation
Low Bleed Resistance
Excellent Long-Term Reliability
Interfacial Wetting: Effective thermal resistance reduction
Environmental Resistance
IT - Notebooks, Servers, Storage Modules
Network Communication Equipment - Wireless Modules, Routers
Consumer Electronics - Gaming Systems, Portable Devices
Industrial Control Equipment
Photovoltaic Inverter
High-power LED Lighting
Attribute | Value | Test Method |
Color | Grey | Visual |
Density(g/cc) | 3.36 | ASTM D792 |
BLT(μm) | 15 | Micrometer |
Volatile Content(%) | ＜0.5 | 125℃,48h |
Physical State | Flowable | Visual |
Viscosity(cP) | 520000 | DV2T-T94-12Rpm |
Cone Penetration(0.1mm @25℃) | 260 | GB/T269 |
Usage Temperature(°C) | -40 to 150 | / |
Shelf Life(months) | 6 | Temperature<40℃ avoid extrusion and exposure to the sun |
Electrical | ||
Breakdown Voltage(kV/mm) | ≥5.0 | ASTM D149 |
Thermal | ||
Thermal Conductivity(W/(m·K)) | 6.42 | ISO 22007-2 |
Thermal Resistance (℃·in2/W @50psi,80℃) | 0.008 | ASTM D5470 |
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