TF 800 is a high thermal conductivity, two-part, 1:1 ratio, ceramic filled silicone dispensable gap filler. Curing at room temperature lends itself to high volume automation. Typical applications are where high thermal performance is required, where high tolerance are present, and designs requiring reduced mechanical stresses.
8.0 W/mK
Room temperature cure
Dispensable and Highly compliant
High volume applications
Networking and Telecommunications
Automotive: Control Modules, Turbo Actuators
Consumer Electronics
Properties | Attribute | Test Method |
Composition | Ceramic Filler + Silicone | - |
Color / Component A | Green | Visual |
Color / Component B | Green | Visual |
Viscosity/ Component A(mPa.s) | 286,800 | ASTM D2196 |
Viscosity/ Component B(mPa.s) | 195,600 | ASTM D2196 |
Flow rate 1 after mixxed(g/min) | 4.18 | @0.4MPa&17 elements |
Flow rate 2after mixxed (g/min) | 7.51 | @0.6MPa&17 elements |
Density (g/cc) | 3.18 | ASTM D792 |
Hardness, after cure (Shore 00) | 60 | ASTM D2240 |
Working time(H) | <1 | @25°C |
Cure time(H) | <24 | @25°C |
Usage Temperature (°C) | - 40 to 150 | - |
Flammability | V-0 | UL 94 |
Electrical | ||
Breakdown voltage (kV/mm) | 10.21 | ASTM D149 |
Volume resistivity (Ω.cm) | 5.8*1013 | ASTM D257 |
Dielectric Constant (1000 Hz) | 4.17 | ASTM D150 |
Thermal | ||
Thermal conductivity (W/m-K) | 8.0 | ASTM D5470 |
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