TF400 is a two-part 1:1 mixed curing heat conduction gel, room temperature curing, and also can be used according to the customer need to heat curing (80 ℃), coefficient of thermal conductivity is 4.0 W/m.K after curing, this product has good flexibility, suitable for some gel mass process, improve production efficiency.
Thermal Conductivity: 4.0 (W/m-K)
Low compression force applications
Adjustable curing time
Excellent high and low temperature mechanical and chemical stability
Automotive Electronics
Fiber Optic Communication Equipment
SSD
Network communication equipment and modules
Between battery pack and cold plate
Properties | Attribute | Test Method |
Color(A/B) | Blue/White | Visual |
Density(g/cc) | 3.1 | ASTM D792 |
Viscosity (Pa.s) | Part A: 1540 | ASTM D2556-14(2018)@ 1rpm |
Part B: 1460 | ||
Operation Time（25℃，H） | ＞2 | / |
Cure Time（25℃，H） | ＜24 | |
Hardness(Shore OO) | 50 | ASTM D2240 |
Low-molecular Weight Silicon Content（D3-D10，ppm） | 95 | US EPA 3550C:2007 &US EPA 8270E:2018 |
Weight Damnify (%) | ≤1.0 | Filter paper adsorption @ 25% compression 125℃ 48H |
Oil Leakage Rate(%) | ＜1.0 | Filter paper adsorption @ 25% compression 125℃ 48H |
Continuous Use Temp(℃) | -40~150 | / |
Flame Rating | V-0 | UL 94 |
Electrical Performance | ||
Breakdown Voltage (kV/mm) | 12 | ASTM D149 |
Volume Resistance(Ω.cm) | 1013 | ASTM D257 |
Dielectric Constant@1000Hz | 5.0 | ASTM D150 |
Thermal Performance | ||
Thermal Conductivity (W/m-K) | 4.0 | ISO 22007-2 |
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