TF350 - L is a low volatile organic silicon thermal conductive adhesive, coefficient of thermal conductivity is 3.5W/(m·K), divided into components of AB, mix according to 1:1, room temperature curing, equivalent of thermal conductive gasket in the cured products. It can work stably at -40 ° C to 150 ° C and meets the flame retardant grade requirements of UL 94 V-0.
Thermal conductivity: 3.5W/(m·K)
Curing time adjustable
Excellent mechanical and chemical stability in wide temperature range
Low compression force applications
Low volatility
SSD
Vehicle Electronics
Fiber Optic Communication Equipment
Network Communication Equipment
Between Heat Generating Semiconductor and Heat Sink
Properties | Attribute | Test Method |
Color (A/B) | Pink/ White | Visual |
Flow rate A/B (g/min) | A: 7±2；B: 7±2 | @0.3MPa/14# Nozzle |
Flow rate as mixed/AB (g/min) | 7.5≤X≤12 | @0.3MPa/F1016 Mixing Head |
Operation Time (min) @25℃ | 20＜x＜30 | The time for the viscosity to rise to twice the initial value after AB is mixed together |
Curing Time (min) @25℃ | ＜70 | Can be adjusted according to customer requirements |
Density (g/cc) | 3.2 | ASTM D792 |
Viscosity (mPa·s) | 2.5 million to 4.5 million | ASTM 2196 @7needle/0.5rpm/5min |
Hardness (Shore 00) | 60 | ASTM D2240 |
Oil bleeding (mm) | ≤2.0 | GB/T 1914-2017 Rapid Filter Paper Adsorption @25°C/24h/Diffusion Diameter |
Volatile Condensate Content | N.D | Visual @150℃/24h & 130℃/48h |
Vertical Flow (mm) | No sagging and fully cured | @Place vertically for 24h |
Usage Temperature (°C) | -40~150 | / |
Flammability | V-0 | UL 94 |
Shelf Life (Month) | 6 | Temperature<40℃ avoid extrusion and exposure to the sun |
Electrical | ||
Breakdown Voltage (kV/mm) | ≥6.0 | ASTM D149 |
Dielectric Constant (@1MHz) | 7.0 | ASTM D150 |
Volume Resistivity (Ω·cm) | 1012 | ASTM D257 |
Thermal | ||
Thermal Conductivity (W/(m·K)) | 3.5 | ISO 22007-2 |
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