TF200-K is a two-part 1:1 mixed and cured thermally conductive gel. It can be cured at room temperature, and can also be heated and cured according to customer needs. The thermal conductivity after curing is 2.0W/m.K. The product has good flexibility and is suitable for dispensing high volume processes to improves production efficiency.
Thermal conductivity: 2.0W/mK
Curing time adjustable
Excellent mechanical and chemical stability in wide temperature range
Low compression force applications
Low volatility
Vehicle Electronics
Fiber Optic Communication Equipment
SSD
Network Communication Equipment
Between Heat Generating Semiconductor and Heat Sink
Properties | Attribute | Test Method |
Color(Part A/B) | White/ Yellow | Visual |
Viscosity(cps A/B) | A:280,000 | ASTM D2196 |
B:280,000 | ||
Operating Time (min,25℃) | ＞60 | Adjustable upon customer requirements |
Curing Time (min,25℃) | ＜8.0 | |
Density (g/cc) | 2.55 | ASTM D792 |
Hardness After Curing (Shore OO ) | 45 | ASTM D2240 |
Usage Temperature (°C) | - 40 to 150 | / |
Flammability | V-0 | UL 94 |
Shelf Life(month) | 6 | Temperature<40℃ avoid extrusion and exposure to sunlight |
Electrical | ||
Breakdown Voltage (kV/mm) | ≥9.0 | ASTM D149 |
Volume Resistivity (Ω.cm) | 1012 | ASTM D257 |
Dielectric Constant | 6.7 | ASTM D150 |
Thermal | ||
Thermal Conductivity (W/m-K) | ≥2.0 | ISO 22007-2 |
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