TF1000 is a two-part 1:1 mixed curing thermal liquid gap filler. Can be formed and cured at room temperature. It can also be heated and cured according to the customer's use needs. After curing, the product is equal to the thermal pad, with a thermal conductivity of 10.0W /(m·K). The product has good flexibility and is suitable for the process of spot gelatinizing in large quantities to improve production efficiency.
Thermal conductivity 10.0W/(m·K)
Easy dispensing
Adjustable curing time
Excellent mechanical and chemical stability at high and low temperatures
Automotive Electronics
Fiber Optic Communication Equipment
SSD
Network communication equipment and modules
Between battery pack and cold plate
Properties | Attribute | Test Method |
Color (A/B) | Light Green | Visual |
Density (g/cc) | 3.1 | ASTM D792 |
Viscosity (mPa·s) | Part A: 374,000 | ASTM D2196 |
Viscosity (mPa·s) | Part B: 1,015,000 | ASTM D2196 |
Flow rate (g/min) | 5.0 | @0.4MPa with 17 elements |
Flow rate (g/min) | 7.7 | @0.6MPa with 17 elements |
Working time (h @25℃) | ≤1 | Adjustable to customer needs |
Cure time (h @25℃) | ＜24 | |
TML (%) | 0.28 | @ 25% compression 125℃ 48h |
Hardness (Shore 00) | 70 | ASTM D2240 |
Usage Temperature (°C) | -60~150 | / |
Flammability | V-0 | UL 94 |
Electrical | ||
Breakdown Voltage (kV/mm) | ≥6.0 | ASTM D149 |
Volume Resistance (Ω·cm) | ＞1010 | ASTM D257 |
Dielectric Constant (@1MHz) | 5.0 | ASTM D150 |
Thermal | ||
Thermal Conductivity (W/(m·K)) | 10.0 | ISO 22007-2 |
Thermal resistance (°C·in2/W @50psi,1mm) | 0.19 | ASTM D5470 |
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