TCK15B is a heat-curing thermally conductive insulating tape. The low modulus silicone is designed to effectively absorb the mechanical stress CTE mismatch, shock and vibration generated by assembly, while providing superior thermal performance (vs. double-sided tape) and long-term integrity. The TCK15B is typically used to structurally bond together power components and heat sinks on PCBs.
Ultra low thermal resistance
Super shear strength
Excellent electrical insulating properties
Long-term use temperature -40℃~150℃
Used to bond individually packaged semiconductors to heat sinks
Properties | Attribute | Test Method |
Color | Gray | Visual |
Carrier | PI film | / |
Thickness(mm) | 0.20 | ASTM D374 |
Bonding Torque (kgf/cm) | ≥15 | / |
Usage Temperature (°C) | - 40 ~150 | / |
Flammability | V-0 | UL 94 |
Shelf Life（month） | 3 | Store at low temperature at 0~8°C, protected from light |
Electrical | ||
Breakdown Voltage (kV) | ＞4.0 | ASTM D149 |
Volume Resistivity (Ω.cm) | 1013 | ASTM D257 |
Dielectric Constant@1MHz | 3.0 | ASTM D150 |
Thermal | ||
Uncured Thermal Impedance (℃*in2/W, @ 50psi) | ≤0.35 | ASTM D5470 |
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