Liquid Gap Filler

The GF series thermally conductive potting material is a two-component system.

After the A/B components are mixed in a certain ratio, the material cures into a soft and elastic solid.

Once cured, it provides excellent protection against moisture, dust, flame, and vibration, along with good sealing, adhesion, and thermal conductivity. It is suitable for heat dissipation and insulation of power electronic components.