HGP8 is an exceptionally soft, graphene-enhanced, TIM1-type oriented pad. It features ultra-low thermal resistance, low density, easy installation, and reworkability.
Low Density
High Compressibility
Ultra-High Thermal Conductivity
Low Effective Thermal Resistance
Within GPU/CPU Packages
Optical Modules and Other High-Power Modules
High-Power Communication Base Station Chip Modules
Attribute | Value | Test Method |
Color | Dark Gray | Visual |
Thickness(mm)① | 0.3±10% | Thickness Gauge |
Density(g/cc) | ＜0.95 | ASTM D792 |
Usage Temperature(°C) | -40 to 150 | IEC 60068-2-14 |
Compressive Stress(psi @50%) | ≤100 | ASTM D575 |
Resilience(％) | ≥60 | ASTM D575 |
Tensile Strength(MPa)② | ≥0.025 | ASTM D412 |
Thermal Resistance (℃·cm²/W @40psi) | ≤0.08 | ASTM D5470 |
Thermal Conductivity(W/(m·K)) | 110 | ASTM D5470 |
Standard Sheet(mm) | 60 × 60 | ASTM D5946 |
NOTE: ① Thickness customization: 0.2-2.0 mm range ② Standard test specimen dimensions: 15 × 40 × 0.3 mm ③ Compatible with edge-bonding or dispensing processes | ||
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