The HGP series is a thermally conductive gap-filling material designed with the goal of achieving “high directional heat conduction.”
It enables direct heat transfer from the heat source to the heat dissipation structure, with an in-plane thermal conductivity up to 130 W/(m·K) and a thermal resistance as low as 0.04 °C·cm²/W.
It establishes a direct “thermal path” between the heat source and the heat sink, quickly reducing contact thermal resistance under limited compression, thereby efficiently transferring heat from the source to the heat dissipation component.
Extremely high thermal conductivity / ultra-low thermal resistance
Excellent elasticity with low compression force
Supports ultra-thin designs
No oil leakage or volatilization
Excellent aging and oxidation resistance, suitable for various working environments and reusable
Simple processing, suitable for automated production and easy rework
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