GF200-L is a low-viscosity, low-volatility thermal conductive two-component silicone potting compound. Comprising A and B components, it self-deairs and cures at room temperature when mixed in a 1:1 ratio. The cured material provides dustproofing, waterproofing, shock resistance, flame retardancy, sealing, adhesion, thermal conduction, and excellent gap-filling. It is suitable for thermally encapsulating heat-generating electronic components.
2.0 W/(m·K)
Adjustable Pot Life (Working Time)
High Electrical Insulation
Good Fluidity and Wettability
Suitable for Automated Operation
OBC, DC-DC, Connectors, Sensors, Amplifiers, etc.
LEDs, Power Supplies, Power Converters, Transformers, High-Voltage Resistors
Pot Life: Use the mixed compound within the pot life.
Properties | Attribute | Test Method |
Color(A/B) | Pink/White | Visual |
Viscosity(cps) | part A: 6,000±1,000 | ASTM D2196 @6 needle,V:100RPM |
part B: 6,000±1,000 | ||
Pot Life(h @25℃) | 1 to 1.5 | The time for the viscosity to rise to twice the initial value after AB is mixed together |
Cure Time(h @25℃) | ＜24 | |
Leveling Property(20mL @5min） | ≥100 | / |
Post-Curing | ||
Density(g/cc) | 2.5±0.2 | ASTM D792 |
Hardness(Shore 00) | 50±10 | ASTM D2240 |
Tensile Strength(MPa) | ≥0.05 | ASTM D412 |
Elongation at Break(%) | ＞30 | ASTM D412 |
Tear Strength(N/mm) | ≥0.1 | ASTM D624 |
Low Molecular Siloxanes D3-D10(ppm) | ≤100 | US EPA 3550C: 2007 US EPA 3550C: 2018 |
Usage Temperature(°C) | -40 to 150 | / |
Flammability | V-0 | UL 94 |
Shelf Life(months) | 6 | Store sealed at<40°C; protect from direct sunlight. |
Electrical | ||
Breakdown Voltage(kV/mm) | ＞7.0 | ASTM D149 |
Dielectric Constant(@1MHz) | 6.0±1.0 | ASTM D150 |
Volume Resistivity(Ω·cm) | ＞1011 | ASTM D257 |
Thermal | ||
Thermal Conductivity(W/(m·K)) | 2.0±0.2 | ISO 22007-2 |
Coefficient of Thermal Expansion@-40~150℃ (ppm/℃) | 120 | ASTM E831-2014 |
Mixing: Mix components A and B thoroughly according to the suggested weight ratio of A:B = 1:1. Note: To ensure optimal product performance, Component A and Component B must each be stirred thoroughly before mixing. Then weigh out the required amounts according to the ratio.
Degassing: Stir the mixed compound thoroughly, then degas under vacuum (pressure < -0.95 MPa) for 2~3 minutes.
Application: Apply/pot the degassed compound.
Curing: The mixed compound begins to react and cure immediately after mixing. Pot life is primarily influenced by temperature, in addition to the product formulation. Higher temperatures accelerate the cure rate, shortening the pot life. Lower temperatures slow the cure rate, extending the pot life. Recommended curing conditions: 90℃ × 15min or 70℃ × 20min.
Specific materials, chemicals, curing agents, and plasticizers can inhibit the cure of thermal conductive potting compounds (silicone rubber). These primarily include: Nitrogen-phosphorus compounds, amines, urethanes, or amine-containing substances. Residues from certain types of fluxes.
Note: If there is doubt whether an object or material might cause cure inhibition, it is recommended to conduct small-scale tests to determine suitability for the application. If no non-cure or partial non-cure phenomena occur during testing, the material can be used with confidence.
Store the two components separately in sealed containers. Open storage severely shortens the shelf life.
If left open continuously for over 7 days before subsequent use, it is recommended to sample and retest properties before deciding whether to use it.
Mix only the amount needed for immediate use (mix on demand). Mixed compound should be used completely in one session to avoid waste.
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