With the continuous increase of the integration density and power density of electronic appliances, the rise of high-power LEDs, etc., electronic devices will release a lot of heat when they are working. Poor thermal conductivity will cause the temperature of the electrical working environment to rise sharply, affecting the operation stability of electronic devices. It even causes damage to the components. If no positive measures are taken, they will be "burned out" by the excess heat released by themselves in minutes. It is said that the reliability of electronic components will drop by 10% for every 2°C increase in temperature.

Due to problems such as twisting and bending of electronic devices caused by inherent products or external forces, micro gaps and holes on the surface are generated during the installation of electronic devices and radiators, resulting in increased contact thermal resistance between electronic devices and radiators. Seriously affect the heat dissipation efficiency of the radiator. Therefore, it is necessary to fill the air gap between the electronic device and the heat sink with thermal conductive gel and remove the air, establish an effective heat conduction channel between the electronic component and the heat sink, greatly reduce the contact thermal resistance, and fully exert the role of the heat sink to achieve effective heat dissipation to ensure the normal operation of electronic devices.

Thermal conductive gel is one of the common heat dissipation methods, and is commonly used in IC packaging and electronic heat dissipation. When assembling microelectronic materials and heat sinks, there are extremely fine uneven gaps between them. If they are installed directly, the actual contact area between them is only 10% of the area of the heat sink base, and the rest are air gaps. And air is a poor conductor of heat, which will seriously hinder the conduction of heat, and eventually cause the efficiency of the radiator to be low. The function of the thermal conductive gel is to fill these air gaps, establish an effective heat conduction channel between the electronic device and the heat sink, reduce the thermal resistance of heat transfer, and improve the heat dissipation performance of the electronic device.

Thermal conductive gel belongs to a kind of gel-like thermal conductive material made of silica gel composite thermal conductive filling material, which is stirred, mixed and packaged. It has good fluidity, and its function is to improve heat conduction for heating devices. It is a composite material with strong heat conduction function. It has high assembly efficiency, lower thermal resistance, and excellent compression deformation effect, good durability.

Functional characteristics of thermal conductive gel:

• Soft in texture, has almost no hardness in liquid state, and has strong surface affinity. It can be stretched into a very thin shape, coated on the surface of various rough electronic components, and can ensure the thermal conductivity of electronic components;

• Good adhesion and adhesion, especially for electronic components, aluminum, PVC, PBT and other plastics, and can ensure good sealing and adhesion after curing;

• Excellent high and low temperature resistance, and the working temperature is -40 ~ 200°C;

• Weak adhesion to the surface of the substrate, can be peeled off from the substrate, and the coated electronic components can be reworked.

How do I choose the right thermal conductive gel?

1. Product protection level

For many companies, when choosing thermal gels, they usually don't know which aspects to start with, so it often leads to wrong selection of thermal gel products. In fact, when choosing a thermal gel, we must pay attention to the protection level of the product, and choose a thermal gel with a higher protection level as much as possible.

2. Heat dissipation efficiency of the product

In order to be able to choose a thermal conductive gel that meets the needs of the enterprise, it is also necessary to pay attention to the heat dissipation efficiency of the product when selecting. Because thermal conductive gel is a general term for heat dissipation materials of electronic products, different materials have different thermal conductivity. Moreover, the heat conduction efficiency will also affect the heat dissipation effect during the actual heat dissipation process, so when selecting a heat conduction gel, it is necessary to choose a heat conduction gel with a higher heat dissipation efficiency.

3. Service life of the product

When choosing a thermal gel, you must also pay attention to the service life of the product. Although the thermal gel is only an auxiliary product, it will affect the stable operation of electronic products, so you must also choose a thermal gel with a longer service life.

Two-part thermal conductive gel has certain shear and tear resistance properties after curing, and it has remarkable performance in application environments such as high vibration, high impact, and harsh aging environments. Widely used in LED chips, communication equipment, mobile phone CPU, memory modules, IGBT and other power modules, power semiconductor fields.

If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com.