How to Solve the Heat Dissipation Problem of the Robot Chip?
- Posted on：2022-12-08 10:39:00
- Source：AOK Thermal Pad Manufacturer Industry News
The application of intelligent robots is becoming more and more extensive, such as smart home robots, unmanned delivery robots, intelligent guidance robots, etc. In many cases, intelligent robots have replaced human labor in important links of intelligent production, and have become an efficient mode of production. The reason why an intelligent robot is called an intelligent robot is because it has a well-developed "brain". What works in the brain is the central processing unit, a computer that has a direct connection to the person who operates it. Most importantly, such a computer can perform purposeful actions. It is for this reason that we say that such robots are real robots, even though they may differ in appearance.
The intelligent robots currently on the market mainly implement specific functions, and robots involving intelligent recognition and interaction are usually realized by accessing AI algorithm chips. There are sensors and processing chips on the main board of the robot, which will generate a lot of heat during use. If the heat is not dissipated in time, the device will continue to heat up, which will easily cause the device to overheat and be damaged.
Like most electronic products, intelligent robots also need to maintain stable operation through heat conduction and heat dissipation. The structure of the motherboard controller will be equipped with a heat sink according to the position of the heat source for heat dissipation. However, due to the gap between the heat source and the heat sink, it is necessary to the thermal interface material is filled in to remove the air in the gap, increase the heat transfer area, reduce thermal resistance, and improve heat dissipation performance, so as to ensure the efficient operation of the robot.
Thermal conductive silicone pad is one of the commonly used thermal interface materials. It is recommended to install it between the heat source of the smart robot chip and the heat sink or shell. Due to the high thermal conductivity, softness, elasticity, and high compression of the thermal silicone pad, it can be closely attached between the chip surface and the heat sink, increasing the heat dissipation efficiency of the robot. At the same time, the material itself has a good electrical insulation effect, is easy to use, is not easy to wear and tear, and is convenient for the installation of the heat dissipation module.
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