Using a thick layer of thermal paste instead of thermal pads is not recommended. Thermal paste and thermal pads serve different purposes and have different properties that make them suitable for specific applications.

Thermal Conductivity: Thermal pads are specifically designed with a certain thickness and composition to provide optimal thermal conductivity between components and heat sinks. While thermal paste is meant to fill in microscopic gaps and imperfections on smooth surfaces, applying it in a thick layer can actually impede heat transfer and reduce overall efficiency.

Consistency: Thermal pads offer a consistent thickness and thermal performance across the entire surface area. A thick layer of thermal paste, on the other hand, can result in uneven distribution and may lead to air pockets or spaces without proper thermal contact, potentially causing hotspots and reducing cooling effectiveness.

Ease of Application: Thermal pads are pre-cut to fit commonly used components, making them easy to apply and ensuring a proper fit. Applying a thick layer of thermal paste may be more challenging and requires careful spreading to achieve an even coating without excess buildup.

Longevity: Thermal pads are typically more durable and stable over time compared to thermal paste. A thick layer of thermal paste may dry out or pump out over extended periods, requiring more frequent reapplication to maintain effective thermal conductivity.

While thermal paste and thermal pads both play important roles in thermal management, they are not interchangeable, and using a thick layer of thermal paste instead of thermal pads is not recommended. It's best to use the appropriate thermal interface material as recommended by the component manufacturer to ensure optimal heat dissipation and maintain the reliability and performance of your electronic devices.

If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com