Thermal pads are available in various thicknesses, including 1.5mm and 1.0mm. The choice of thickness depends on the specific application requirements and the gap size between the components you are working with.
A thermal pad with a thickness of 1.5mm is commonly used when there is a larger gap between the heat source (e.g., a semiconductor component) and the heat sink or cooling solution.
This thickness allows for better thermal contact and filling of larger gaps, ensuring efficient heat transfer between the components. It's suitable for applications where there is more tolerance for gap thickness, or when the components have uneven surfaces that need to be bridged.
A thermal pad with a thickness of 1.0mm is generally used when there is a smaller gap between the components. This thickness is suitable for applications with tighter tolerances or when the surfaces of the components are relatively flat and require less filling.
It can provide effective heat transfer in scenarios where a thinner thermal interface is required. When selecting the appropriate thermal pad thickness, consider factors such as the recommended gap thickness specified by the component manufacturer, the level of compression desired for optimal thermal contact, and any specific requirements of the application.
It's worth noting that thermal pads are often available in multiple thickness options, allowing you to choose the most suitable one for your specific needs. Refer to the product datasheets, manufacturer specifications, or consult with the supplier for guidance on selecting the appropriate thermal pad thickness for your application.
If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com
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