Silicone free thermal pads are thermal interface material that are treated with special resins based on metal oxides and special additives, and are often referred to as non silicon thermal pads, silicone free thermal pads, etc. in the industry. Silicone free thermal pads is a soft, silicone free gap filling thermally conductive material with high thermal conductivity, low thermal resistance, high compressibility, controllable hardness, and no silicone small molecules in the pressurized and heated operating environment volatile, to avoid adsorption on the PCB board due to the volatilization of small siloxane molecules, which indirectly affects the performance of the body. The silicon free thermal pads acts on the gap between the heat source and the radiator/housing. Due to its good softness, it can effectively remove the air at the interface, reduce the thermal resistance of the interface, and improve the thermal conductivity.

The material of the silicone free thermal pads does not contain any silane forming molecules at all, so there is no need to worry about circuit failure caused by the precipitation of silicone oil or the volatilization of siloxane. It has very good tensile strength and elongation, and at the same time inherits the high thermal conductivity of thermal silicone pads. Performance and good electrical insulation properties.

silicone free thermal pads, compared with traditional silicone thermal pads, the obvious advantage of silicone free thermal pads is that the content of low molecular siloxane is zero, which solves the problem of silicone oil volatility that many engineers worry about. After long term repeated tests, the low-molecular weight siloxane did not precipitate, which is much better than the silicone thermal pads used before, and the thermal conductivity is also 3.0w/m.k. Not only the temperature is lowered better, but also the PCB board can be removed after rework. Also very clean with no dirt on it.

Our silicone free thermal pads are very soft which is beneficial for reducing applied stress on the PCB and lowering the thermal resistance. That aid in the dissipation of heat from intended targets to cooler surface areas within an electronic device. They are often used to cool SSD (solid state drives) or can be attached to the bottom of heatsinks, to act as a thermal interface bridge between surfaces to accommodate thermal conductivity to alleviate over heating of an electronic device.

Features

• Silicone free, thermal conductivity: 3W/m.K

• Low dielectric constant

• Differential tack option available for easy assembly and rework

• Minimal compression set

• Environmentally friendly solution that meets regulatory requirements including RoHS and REACH

Applications

• Products that are afraid of silicone oil contamination

• Optical precision equipment

• laptop, projector

• Mobile and communication equipment, high-speed mass storage drives, heat pipe components, automotive engine control equipment, telecommunications hardware and equipment, high-end industrial control and medical electronics, etc.

If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com.