Silicone thermal interface materials fill a fine gap between a heat-generating unit and a heatsink, and efficiently transfer heat.

Silicone thermal interface materials (TIMs) are compound materials which contain a high ratio of thermally conductive fillers, are materials used to dissipate and improve the transfer of heat out of electronics devices. Generally, they are placed between the heat-generating chip or component and the heat spreading substrate or dissipating device.

There are very fine uneven gaps between the surface of the microelectronic material and the heat sink. If they are directly installed together, the actual contact area between them is only 10% of the base area of the heat sink, and the rest are air gaps. Because the thermal conductivity of air is only 0.024W/m·K, it's a poor conductor of heat, which will lead to a very large contact thermal resistance between the electronic components and the heat sink, which seriously hinders the conduction of heat, and finally causes the performance of the heat sink to be low.

Fill these gaps with thermal interface materials (TIMs) with high thermal conductivity, remove the air in them, and establish an effective heat conduction channel between the electronic components and the heat sink, which can greatly reduce the contact thermal resistance and make the heat sink fully play its.

Silicone thermal interface materials have been widely adopted in many industries such as consumer electronics, electrical vehicles, data centers, 5G, and advanced driver-assistance systems (ADAS). AOK offers an optimal electronic heat dissipation solution tailored to the required usage and performance from a wide range of product lineups.

If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com.