Experts in Heat Dissipation and Thermal Conduction, AOK Showcase Technical Prowess at the Shenzhen CMF 2024 Exhibition

Shenzhen CMF 2024 Exhibition

A range of high-performance heat dissipation solutions designed to meet the increasing demands of modern electronic devices, automotive applications, and other heat-sensitive systems. These solutions encompassed thermal management pad, phase change thermal interface materials, thermally conductive gel, and more, all engineered to optimize heat transfer efficiency and enhance overall system performance.

AOK expert engineers and technicians collaborated closely with clients to understand their unique thermal management needs and offered personalized solutions that effectively addressed heat dissipation challenges in their systems.

At that time, warmly welcome domestic and foreign thermal and heat dissipation material enterprises and their related industry professionals to visit and communicate with AOK booth.

Booth No.: No. D007, Hall 11

Exhibition time: June 19-21, 2024

Venue: Shenzhen World Exhibition Center (Baoan New Hall No. 11)

If you would like to learn more about AOK performance thermal materials, please visit our website at

Updated on:2024-06-11 16:13:53
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