Efficient Heat Dissipation: The Smart Charging Magic of UGREEN Ultra+ Power Box
- Posted on：2024-01-24 09:22:00
- Source：AOK Thermal Pad Manufacturer Industry News
UGREEN 200W 4C1A Smart Charging Magic Box Ultra+ is a smart charging device equipped with high power and multiple charging interfaces. At the same time, it also has a heat dissipation function, which can effectively reduce the temperature of the device and ensure safe and stable charging.
Electronic devices with high power outputs, such as chargers or power banks, employ various heat dissipation methods to manage heat effectively. Some common heat dissipation methods used in such devices include:
Heat sinks: Heat sinks are designed to absorb and dissipate heat away from the components. They typically consist of metal fins or plates that increase the surface area for better heat dissipation.
Thermal pads or thermal paste: These are used to improve the thermal contact between the heat-generating components, such as power conversion circuits or charging modules, and the heat sink or metal casing. They help enhance heat transfer between the components and the surrounding surfaces.
Ventilation and airflow: Adequate ventilation and airflow pathways are essential for heat dissipation. Devices may incorporate fans, vents, or other openings to facilitate the movement of air and dissipate heat.
Heat pipes: Heat pipes are often used in high-power devices to transfer heat efficiently. They consist of sealed copper pipes containing a liquid or gas that vaporizes and condenses, transferring heat away from the source to a cooler area.
Effective device design, such as component placement, thermal insulation, and thermal management techniques, can contribute to efficient heat dissipation. The maximum temperature of the UGREEN 200W smart charging magic box Ultra+ (4C1A) at the output voltage of 220V 50Hz and 110V 60Hz is 55.4°C. The maximum temperature during the load test meets the IEC International Electrotechnical Commission IEC62368 and the new national standard GB4943.1 2022 for electronic and electrical During equipment testing, the temperature shall not exceed the requirement of 77°C.
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