Using a thermal pad instead of paste for air cooling can indeed be a strategic move, depending on the situation. Thermal pads offer certain advantages over thermal paste:
Easy to Apply: Thermal pads are simpler to install compared to the sometimes tricky application of thermal paste.
Consistent Thickness: Pads provide a uniform layer of material, which eliminates the risk of too much or too little paste application.
Longer Lifespan: Pads tend to last longer without drying out or degrading over time like paste can.
No Mess: They are clean and reusable in some cases, unlike paste, which can be messy and tricky to remove.
Better for Large Gaps: In cases where there's a larger gap between the heatsink and the component, thermal pads can provide a better thermal bridge than paste.
Lower Performance: In terms of raw thermal conductivity, pastes (especially high-quality ones) usually outperform thermal pads. Pads are generally more suited to less demanding systems.
Pressure Requirements: Pads rely on consistent pressure to maintain contact, which can sometimes lead to uneven cooling if not applied properly.
If the cooling setup is well-designed and the thermal pad makes consistent contact between the surfaces, it's a smart solution for longevity and ease of maintenance. However, for higher-end cooling needs, paste might still offer a performance edge.
If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com
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