As laptop continue to integrate powerful functions into smaller components, temperature control has become one of the most critical design challenges. More heat generated by large unit power. Chipmakers have been working to increase the speed and processing power of laptop CPUs, which requires ever-improving cooling for microprocessors.

Chipmakers are more focused than ever on thermally conductive materials (thermal pads) and other technologies that remove excess heat that can adversely affect component stability and longevity. And a small temperature reduction (10 ~ 15°C) can double the life of the device. Cooler operating temperatures also reduce signal latency, which helps improve processing speeds. In addition, lower temperatures also reduce the idle power dissipation (dissipated power) of the device, which can reduce the overall power dissipation heat.

From an engineering point of view, the heat conduction pad is designed to match the irregular surface of the material, use high-performance heat conduction materials, and eliminate air gaps, thereby improving the overall heat conversion capability and making the device work.

Thermal pads are used to fill the air gap between heat-generating components and heat sinks or metal bases, and their flexible, resilient characteristics allow them to be used to cover very uneven surfaces. Heat is conducted from discrete components or the entire PCB to the metal housing or spreader, thereby improving the efficiency and lifespan of heat-generating electronic components.

In the use of thermal pads, pressure and temperature are mutually restrictive. As the temperature rises, after the equipment has been in operation for a period of time, the thermal pad material will soften, creep, and stress relax, and its mechanical strength will also decrease. The pressure of the seal is reduced.

The heat conduction pad is based on silica gel, adding certain metal oxides and various heat conduction auxiliary materials, and then synthesizing the heat conduction pad through a special process. The heat conduction gasket is a polymer composite heat conduction material that uses silicone resin as the bonding base material and is filled with heat conduction powder to achieve the purpose of heat conduction.

Properties of Thermal Pads

1. It has good elasticity and recovery, and can adapt to pressure changes and temperature fluctuations;

2. It has proper softness and can fit well with the contact surface;

3. No pollution to the process medium;

4. Have sufficient toughness without causing damage due to pressure and fastening force;

5. No hardening at low temperature, small shrinkage;

6. Good processing performance, easy installation and compression;

7. Non-stick sealing surface, easy to disassemble;

8. Cheap price and long service life.

The thermal pad has good thermal conductivity and high-grade pressure resistance. It is an alternative product to replace thermal grease. The material itself has a certain degree of flexibility and fits well between power devices and heat-dissipating aluminum sheets or machine casings. To achieve the best heat conduction and heat dissipation purpose, the heat conduction pad meets the requirements of the electronic industry for heat conduction materials in the 21st century.

If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com.