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072023.02
GA200 Thermally Conductive Gel Flow Rate Lab TestThermally conductive gel, available in one-component liquid formable and curable formulations, are t...Learn More→ -
202022.12
Thermally Conductive Gel Tensile Strength TestStandard-compliant tests performed throughout development in our accredited test-and-release laborat...Learn More→ -
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Professional Silicone Thermal Pads Die-cut ProcessingTP150 series thermal pad is a high-performance silicone thermal pad. With AOK unique formulation, it...Learn More→ -
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How We Product Thermal Interface MaterialWe design, develop and deliver industry leading thermal solutions that protect electronics. Enhancin...Learn More→ -
252022.11
One-Part Dispensable Gap Filler Dispensing TestTM series one-part dispensable gap fillers are non-curing ceramic filled silicone materials. They ar...Learn More→ -
232022.11
Die-cutting process of soft silicone thermal padThe silicone thermal pad after high temperature treatment needs to be placed for a period of time, a...Learn More→
