To test the thermal conductivity and stability of a thermal pad, you can use the following methods:

Thermal conductivity measurement: You can use a thermal conductivity tester or a thermal imaging camera to measure the thermal conductivity of the thermal pad. The thermal conductivity tester measures the thermal resistance and thermal conductivity of the thermal pad, while the thermal imaging camera can detect the temperature distribution of the thermal pad and its surroundings, which can indicate the thermal conductivity of the thermal pad.

Thermal stability test: You can use an environmental chamber or an oven to test the thermal stability of the thermal pad. The thermal pad is placed in the chamber or oven, and the temperature is raised to a certain level and maintained for a period of time. The thermal stability of the thermal pad can be evaluated by measuring the change in it's thermal conductivity and physical properties before and after the test.

Compression test: You can use a compression tester to test the compression performance of the thermal pad. The thermal pad is compressed to a certain degree, and the compression force and deformation are measured. The compression test can evaluate the compressibility and resilience of the thermal pad, which are important factors that affect its thermal conductivity and stability.

Real-world application test: Finally, you can also test the thermal conductivity and stability of the thermal pad in real-world applications, such as applying it between a heat sink and a PCB module. By monitoring the temperature of the PCB module and the heat sink, you can evaluate the thermal performance and stability of the thermal pad under actual operating conditions.

Overall, a combination of these testing methods can provide a comprehensive evaluation of the thermal conductivity and stability of a thermal pad.

If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com