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Datacom Solution
Thermal interface material for cooling electronic components
Datacom
  • Solution Overview

    The smart router is based on an open system and supports application installation, such as network acceleration, overturning the wall, advertising filtering, NFC, etc. Some smart routers are also equipped with large-capacity hard drives or support external SD cards, which can be used as storage devices. In short, the smart router has become a small computer. With the increase of product functions, the heat dissipation of the device will become a very severe test for engineers (increased heating components, increased power consumption, and compact structure). The requirements for thermal conductivity materials will also increase. The more diverse.

  • Solution

    Netcom product types

    Datacom Solution

    Netcom product types

    Product Model  Details

    Product model detail diagram

    Schematic diagram of wireless router structure

    AOK-Schematic diagram of wireless router structure

    Schematic diagram of wireless router structure

    1

    AOK-Schematic diagram of wireless router structure

    2

    AOK-Schematic diagram of wireless router structure

    Schematic diagram of shell heat conduction

    AOK-Schematic diagram of shell heat conduction

    Internal structure diagram of portable WLAN equipment

     AOK-Internal structure diagram of portable WLAN equipment

    Modem internal structure diagram

    AOK-Modem internal structure diagram

    Schematic diagram of temperature rise

    AOK-Schematic diagram of temperature rise

    Router temperature rise :

    Indoor: The test surface temperature does not exceed 60°C in full load operation at ambient temperature; the CPU temperature does not exceed 80°C; over-temperature and frequency reduction.

    Outdoor: Test the surface temperature of 70°C-80°C under full load at ambient temperature; the maximum temperature of CPU is 110-120°C, over-temperature frequency reduction

    Portable WLAN temperature rise: running at full load at room temperature, the surface temperature of the device does not exceed 55°C, the CPU temperature does not exceed 65°C, and the frequency is over-temperature reduced.

    Portable WLAN

    AOK-Portable WLAN

    Product   application scenarios

    Product application scenarios

    Main heating chip power and thermal interface material selection-thermal pad

    AOK-Main heating chip power and thermal interface material selection

    Heat source power Materials used Usage special requirements
    1-2W/3-5W thermal pad
    Thermal Conductivity:1.2-2.5w/m.k
    Thickness:0.25-1.0mm
    Breakdown Voltage:6kv
    Fill the gap between the CPU, ADSL, wireless module and the aluminum radiator, transfer the chip heat to the radiator, and play the role of heat conduction and shock absorption. Because routers/portable WLANs involve high-frequency emission sources such as wireless transmitting antennas, the requirements for gaskets must not affect electromagnetic waves.

    Main heating chip power and thermal interface material selection-thermal pad

    AOK-Main heating chip power and thermal interface material selection

    Heat source power Materials used Usage special requirements
    2-4W thermal pad
    Thermal Conductivity : 1.5-2.5w/m.k
    Thickness:0.5-1.0mm
    Breakdown Voltage:6kv
    Thermal conduction, filling and shock absorption between the internal decoding chip, main chip and output control IC of the Modem module and the aluminum radiator. Because routers/portable WLANs involve high-frequency emission sources such as wireless transmitting antennas, the requirements for gaskets must not affect electromagnetic waves.

    Other router structures

    AOK-Other router structures

    Other router structures

    AOK-switch

    Schematic diagram of switch structure

    1

    AOK-Schematic diagram of switch structure

    2

    AOK-Schematic diagram of switch structure


    Heat source power Materials used Usage
    1-2W/3-5W thermal pad
    Thermal Conductivity:1.0-1.5w/m.k
    Thickness:0.25-1.0mm
    Breakdown Voltage:6kv
    Fill the gap between the CPU, ADSL, wireless module and the aluminum radiator, transfer the chip heat to the radiator, and play the role of heat conduction and shock absorption.

    The future development trend of  Netcom

    The future trend of Netcom

    Hardware and functions-smart router

    With the increase of product functions, the heat dissipation of the device will become a very severe test for engineers (increased heating components, increased power consumption, and compact structure). The requirements for thermal conductivity materials will also increase. The more diverse.

    Network traffic growth

    With the intelligentization of processing electrical appliances and electronic products, many electronic devices need to be operated and controlled through the network, so the working frequency and intensity of Netcom products will increase accordingly, and the rapid increase in network speed will also increase the power of Netcom products. And other issues still bring higher demand for heat dissipation.

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Shenzhen Aochuan Technology Co., Ltd.
Email: sales@aok-technologies.com
Phone:   +86 755 2976 5652  
Post Code:518110   
Address: 302 GuihuaRoad, GuixiangVillage, GuanlanTown, 
LonghuaDistrict, Shenzhen City,Guangdong Province, P.R China
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