Datacom Solution

Datacom

Solution Overview

The smart router is based on an open system and supports application installation, such as network acceleration, overturning the wall, advertising filtering, NFC, etc. Some smart routers are also equipped with large-capacity hard drives or support external SD cards, which can be used as storage devices. In short, the smart router has become a small computer. With the increase of product functions, the heat dissipation of the device will become a very severe test for engineers (increased heating components, increased power consumption, and compact structure). The requirements for thermal conductivity materials will also increase. The more diverse.

Solution

Netcom product types

Datacom Solution

Netcom product types

Product Model Details

Product model detail diagram

Schematic diagram of wireless router structure

AOK-Schematic diagram of wireless router structure

Schematic diagram of wireless router structure

AOK-Schematic diagram of wireless router structure

Schematic diagram of shell heat conduction

AOK-Schematic diagram of shell heat conduction

Internal structure diagram of portable WLAN equipment

AOK-Internal structure diagram of portable WLAN equipment

Modem internal structure diagram

AOK-Modem internal structure diagram

Schematic diagram of temperature rise

AOK-Schematic diagram of temperature rise

Router temperature rise :

Indoor: The test surface temperature does not exceed 60°C in full load operation at ambient temperature; the CPU temperature does not exceed 80°C; over-temperature and frequency reduction.

Outdoor: Test the surface temperature of 70°C-80°C under full load at ambient temperature; the maximum temperature of CPU is 110-120°C, over-temperature frequency reduction

Portable WLAN temperature rise: running at full load at room temperature, the surface temperature of the device does not exceed 55°C, the CPU temperature does not exceed 65°C, and the frequency is over-temperature reduced.

Portable WLAN

AOK-Portable WLAN

Product application scenarios

Main heating chip power and thermal interface material selection-thermal pad

AOK-Main heating chip power and thermal interface material selection

Heat source power	Materials used	Usage	special requirements
1-2W/3-5W	thermal pad Thermal Conductivity:1.2-2.5w/m.k Thickness:0.25-1.0mm Breakdown Voltage：6kv	Fill the gap between the CPU, ADSL, wireless module and the aluminum radiator, transfer the chip heat to the radiator, and play the role of heat conduction and shock absorption.	Because routers/portable WLANs involve high-frequency emission sources such as wireless transmitting antennas, the requirements for gaskets must not affect electromagnetic waves.

Main heating chip power and thermal interface material selection-thermal pad

AOK-Main heating chip power and thermal interface material selection

Heat source power	Materials used	Usage	special requirements
2-4W	thermal pad Thermal Conductivity : 1.5-2.5w/m.k Thickness:0.5-1.0mm Breakdown Voltage：6kv	Thermal conduction, filling and shock absorption between the internal decoding chip, main chip and output control IC of the Modem module and the aluminum radiator.	Because routers/portable WLANs involve high-frequency emission sources such as wireless transmitting antennas, the requirements for gaskets must not affect electromagnetic waves.

Other router structures

AOK-Other router structures

Other router structures

AOK-switch

Schematic diagram of switch structure

AOK-Schematic diagram of switch structure

Heat source power	Materials used	Usage
1-2W/3-5W	thermal pad Thermal Conductivity：1.0-1.5w/m.k Thickness:0.25-1.0mm Breakdown Voltage：6kv	Fill the gap between the CPU, ADSL, wireless module and the aluminum radiator, transfer the chip heat to the radiator, and play the role of heat conduction and shock absorption.

The future development trend of Netcom

The future trend of Netcom

Hardware and functions-smart router

With the increase of product functions, the heat dissipation of the device will become a very severe test for engineers (increased heating components, increased power consumption, and compact structure). The requirements for thermal conductivity materials will also increase. The more diverse.

Network traffic growth

With the intelligentization of processing electrical appliances and electronic products, many electronic devices need to be operated and controlled through the network, so the working frequency and intensity of Netcom products will increase accordingly, and the rapid increase in network speed will also increase the power of Netcom products. And other issues still bring higher demand for heat dissipation.