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Solution Overview
The smart router is based on an open system and supports application installation, such as network acceleration, overturning the wall, advertising filtering, NFC, etc. Some smart routers are also equipped with large-capacity hard drives or support external SD cards, which can be used as storage devices. In short, the smart router has become a small computer. With the increase of product functions, the heat dissipation of the device will become a very severe test for engineers (increased heating components, increased power consumption, and compact structure). The requirements for thermal conductivity materials will also increase. The more diverse.
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Solution
Netcom product types
Product Model Details
Product model detail diagram
Schematic diagram of wireless router structure
Schematic diagram of wireless router structure
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Schematic diagram of shell heat conduction
Internal structure diagram of portable WLAN equipment
Modem internal structure diagram
Schematic diagram of temperature rise
Router temperature rise :
Indoor: The test surface temperature does not exceed 60°C in full load operation at ambient temperature; the CPU temperature does not exceed 80°C; over-temperature and frequency reduction.
Outdoor: Test the surface temperature of 70°C-80°C under full load at ambient temperature; the maximum temperature of CPU is 110-120°C, over-temperature frequency reduction
Portable WLAN temperature rise: running at full load at room temperature, the surface temperature of the device does not exceed 55°C, the CPU temperature does not exceed 65°C, and the frequency is over-temperature reduced.
Portable WLAN
Product application scenarios
Product application scenarios
Main heating chip power and thermal interface material selection-thermal pad
Heat source power Materials used Usage special requirements 1-2W/3-5W thermal pad
Thermal Conductivity:1.2-2.5w/m.k
Thickness:0.25-1.0mm
Breakdown Voltage:6kvFill the gap between the CPU, ADSL, wireless module and the aluminum radiator, transfer the chip heat to the radiator, and play the role of heat conduction and shock absorption. Because routers/portable WLANs involve high-frequency emission sources such as wireless transmitting antennas, the requirements for gaskets must not affect electromagnetic waves. Main heating chip power and thermal interface material selection-thermal pad
Heat source power Materials used Usage special requirements 2-4W thermal pad
Thermal Conductivity : 1.5-2.5w/m.k
Thickness:0.5-1.0mm
Breakdown Voltage:6kvThermal conduction, filling and shock absorption between the internal decoding chip, main chip and output control IC of the Modem module and the aluminum radiator. Because routers/portable WLANs involve high-frequency emission sources such as wireless transmitting antennas, the requirements for gaskets must not affect electromagnetic waves. Other router structures
Other router structures
Schematic diagram of switch structure
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Heat source power Materials used Usage 1-2W/3-5W thermal pad
Thermal Conductivity:1.0-1.5w/m.k
Thickness:0.25-1.0mm
Breakdown Voltage:6kvFill the gap between the CPU, ADSL, wireless module and the aluminum radiator, transfer the chip heat to the radiator, and play the role of heat conduction and shock absorption. The future development trend of Netcom
The future trend of Netcom
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Hardware and functions-smart router
With the increase of product functions, the heat dissipation of the device will become a very severe test for engineers (increased heating components, increased power consumption, and compact structure). The requirements for thermal conductivity materials will also increase. The more diverse.
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Network traffic growth
With the intelligentization of processing electrical appliances and electronic products, many electronic devices need to be operated and controlled through the network, so the working frequency and intensity of Netcom products will increase accordingly, and the rapid increase in network speed will also increase the power of Netcom products. And other issues still bring higher demand for heat dissipation.
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