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Security industry classification
Product model details
Product model detail diagram
Schematic diagram of the structure of the box camera
Heat dissipation structure diagram-image processing module
Heat dissipation structure-A board heat dissipation icon
Heat dissipation structure-power board heat dissipation icon
Schematic diagram of shell heat conduction
Schematic diagram of temperature rise
Product application scenarios
Product application scenarios
Main heating chip power and thermal interface material selection-image processing module
Heat source power Materials used Usage special requirements 720P-1.0-1.5W/
1080P-2.5-3.5W/ 4K-6W+thermal pad
Thermal Conductivity: 1.5-6w/m.k
Thickness: 0.5-1.0mm
Breakdown Voltage: 6kvThe image processing module on the PCB board generates a large amount of heat and requires independent heat dissipation. The thermally conductive silicone sheet is attached to the pins on the back of the module to conduct the heat of the image processing module to the aluminum back cover for heat dissipation. Hardness: less than 20 degrees Shore 00, super soft material with low oil separation or no silicon material (oil separation will cause pollution to the photosensitive module and affect the image quality.) Low volatility test standard: put the thermal conductive material in a closed beaker and cover it Frosted glass cover, burned in a 80°C oven for 48 hours, without volatile oil stains. Selection of main heating chip power and thermal interface material-A board
Heat source power Materials used Usage 1-4W thermal pad
Thermal Conductivity: 1.5-2.0w/m.k
Thickness: 0.5-1.0mm
Breakdown Voltage: 6kvFill the gap between the heating electronic components (CPU & memory/video memory) on the A board and the aluminum die-casting shell, and conduct the heat to the shell for heat dissipation. Selection of main heating chip power and thermal interface material-Power Board
Heat source power Materials used Usage 1-2.5W thermal pad
Thermal Conductivity: 1.0-1.5w/m.k
Thickness: 0.5-1.0mm
Breakdown Voltage: 6kv1、Filling heat conduction between the transformer on the power board and the aluminum die casting shell.；
2. The filling between the diode on the power board and the copper radiator conducts heat.Schematic diagram of the structure of the tube camera
Drum machine heat dissipation structure diagram
Main heating chip power and thermal interface material selection-image processing module
Heat source power Materials used Usage special requirements 720P-1.0-1.5W/ 1080P-2.5-3.5W/ 4K-6W+ thermal pad
Thermal Conductivity: 1.5-6w/m.k
Thickness: 0.5-1.0mm
Breakdown Voltage: 6kvThe image processing module on the PCB board generates a large amount of heat and requires independent heat dissipation. The thermally conductive silicone sheet is attached to the pins on the back of the module to conduct the heat of the image processing module to the aluminum back cover for heat dissipation. Hardness: less than 20 degrees Shore 00, super soft material with low oil separation or no silicon material (oil separation will cause pollution to the photosensitive module and affect the image quality. ) Selection of main heating chip power and thermal interface material-A board
Heat source power Materials used Usage 1-4W thermal pad
Thermal Conductivity: 1.5-2.0w/m.k
Thickness: 0.5-1.0mm
Breakdown Voltage: 6kvFill the gap between the heating electronic components (CPU & memory/video memory) on the A board and the aluminum die-casting shell, and conduct the heat to the shell for heat dissipation. Security products future development direction
Future development direction of security products
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The current mainstream camera 720P is gradually moving towards high-end, with high-definition pixels, 1080P, 4K image quality, etc., the demand for thermal interface materials will also increase to 6W-15W, and the oil separation of thermal interface materials will be higher.
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Major security equipment manufacturers are gradually introducing cloud storage solutions. Cloud storage has become a trend in future storage development. At present, cloud storage vendors are integrating various search, application technologies and cloud The combination of storage can provide a series of data services to enterprises; as a result, data storage equipment will move towards larger and higher-end servers and mainframes, and the demand for thermal materials will be more PC-based.
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