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Security products Solution
Thermal interface material for security products solution
Security products solution
  • Solution Overview

    The current mainstream camera 720P is gradually moving towards high-end, with high-definition pixels, 1080P, 4K image quality, etc., the demand for thermal interface materials will also increase to 6W-15W, and the oil separation of thermal interface materials will be higher.

  • Solution

    Security industry classification


    Security cooling application


    Security industry classification

    Product model details

    Product model detail diagram

    Schematic diagram of the structure of the box camera

    Schematic diagram of the structure of the box camera

    Heat dissipation structure diagram-image processing module

    Heat dissipation structure diagram-image processing module

    Heat dissipation structure-A board heat dissipation icon

    Security products solution

    Heat dissipation structure-power board heat dissipation icon

    Security products solution

    Schematic diagram of shell heat conduction

    Security products solution

    Schematic diagram of temperature rise

    Security products solution

    Security products solution

    Product application scenarios

    Product application scenarios

    Main heating chip power and thermal interface material selection-image processing module

    Security products solution

    Heat source power Materials used Usage special requirements
    720P-1.0-1.5W/
    1080P-2.5-3.5W/ 4K-6W+
    thermal pad
    Thermal Conductivity: 1.5-6w/m.k
    Thickness: 0.5-1.0mm
    Breakdown Voltage: 6kv
    The image processing module on the PCB board generates a large amount of heat and requires independent heat dissipation. The thermally conductive silicone sheet is attached to the pins on the back of the module to conduct the heat of the image processing module to the aluminum back cover for heat dissipation. Hardness: less than 20 degrees Shore 00, super soft material with low oil separation or no silicon material (oil separation will cause pollution to the photosensitive module and affect the image quality.) Low volatility test standard: put the thermal conductive material in a closed beaker and cover it Frosted glass cover, burned in a 80°C oven for 48 hours, without volatile oil stains.

    Selection of main heating chip power and thermal interface material-A board

    Selection of main heating chip power and thermal interface material-A board

    Heat source power Materials used Usage
    1-4W thermal pad
    Thermal Conductivity: 1.5-2.0w/m.k
    Thickness: 0.5-1.0mm
    Breakdown Voltage: 6kv
    Fill the gap between the heating electronic components (CPU & memory/video memory) on the A board and the aluminum die-casting shell, and conduct the heat to the shell for heat dissipation.

    Selection of main heating chip power and thermal interface material-Power Board

    Selection of main heating chip power and thermal interface material-Power Board

    Heat source power Materials used Usage
    1-2.5W thermal pad
    Thermal Conductivity: 1.0-1.5w/m.k
    Thickness: 0.5-1.0mm
    Breakdown Voltage: 6kv
    1、Filling heat conduction between the transformer on the power board and the aluminum die casting shell.;
    2. The filling between the diode on the power board and the copper radiator conducts heat.

    Schematic diagram of the structure of the tube camera

    Schematic diagram of the structure of the tube camera

    Drum machine heat dissipation structure diagram

    Drum machine heat dissipation structure diagram

    Main heating chip power and thermal interface material selection-image processing module

    Security products solution

    Heat source power Materials used Usage special requirements
    720P-1.0-1.5W/ 1080P-2.5-3.5W/ 4K-6W+ thermal pad
    Thermal Conductivity: 1.5-6w/m.k
    Thickness: 0.5-1.0mm
    Breakdown Voltage: 6kv
    The image processing module on the PCB board generates a large amount of heat and requires independent heat dissipation. The thermally conductive silicone sheet is attached to the pins on the back of the module to conduct the heat of the image processing module to the aluminum back cover for heat dissipation. Hardness: less than 20 degrees Shore 00, super soft material with low oil separation or no silicon material (oil separation will cause pollution to the photosensitive module and affect the image quality. )

    Selection of main heating chip power and thermal interface material-A board

    Selection of main heating chip power and thermal interface material-A board

    Heat source power Materials used Usage
    1-4W thermal pad
    Thermal Conductivity: 1.5-2.0w/m.k
    Thickness: 0.5-1.0mm
    Breakdown Voltage: 6kv
    Fill the gap between the heating electronic components (CPU & memory/video memory) on the A board and the aluminum die-casting shell, and conduct the heat to the shell for heat dissipation.

    Security products future development direction

    Future development direction of security products

    The current mainstream camera 720P is gradually moving towards high-end, with high-definition pixels, 1080P, 4K image quality, etc., the demand for thermal interface materials will also increase to 6W-15W, and the oil separation of thermal interface materials will be higher.

    Major security equipment manufacturers are gradually introducing cloud storage solutions. Cloud storage has become a trend in future storage development. At present, cloud storage vendors are integrating various search, application technologies and cloud The combination of storage can provide a series of data services to enterprises; as a result, data storage equipment will move towards larger and higher-end servers and mainframes, and the demand for thermal materials will be more PC-based.

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LonghuaDistrict, Shenzhen City,Guangdong Province, P.R China
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