TP 800 Series thermal pad
TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features：Thermal conductivity：8.0W/mK，High electrical insulation
Typical applications：Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
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Typical applications：Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
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Product feature■ Thermal conductivity：8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force -
Typical applications■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Product Specifications
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | Pink | Visual |
| Thickness（mm） | 0.5~6.5 | astm d374 |
| Density（g/cc） | 3.3 | ASTM D792 |
| Hardness（shore oo） | 55 | ASTM D2240 |
| Usage Temperature（℃） | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage（kv/mm） | ＞6.0 | ASTM D149 |
| Dielectric Constant（@10mhz） | 7.2 | ASTM D150 |
| Volume Resistivity（Ω.cm） | 10^12 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal |
|
|
| Thermal conductivity（W/m.K） | 8.0 | ASTM D5470 |
Purchase information
Standard size: T≤1.5mm，size=200*400mm; T＞1.5mm，size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
Product Performance
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