TP 800 Series thermal pad
TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
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Product Specifications
Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~6.5 astm d374
Density(g/cc) 3.3 ASTM D792
Hardness(shore oo) 55 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) >6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 10^12 ASTM D257
Flammability V-0 UL94
Thermal

Thermal conductivity(W/m.K) 8.0 ASTM D5470
Purchase information

Standard size: T≤1.5mm,size=200*400mm; T>1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.

Product Performance