TP 700 Series thermal pad
TP 700 Series Thermal pads are used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.
Product features:Thermal Conductivity:7.0W/mK,High thermal conductivity
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
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Product Specifications
Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color light blue Visual
Thickness(mm) 0.5~10.0 astm d374
Density(g/cc) 3.3 ASTM D792
Hardness(shore oo) 50±5 ASTM D2240
Usage Temperature(℃) -40~150 --
Breakdown Voltage(kv/mm) >6.0 ASTM D149
Dielectric Constant(@10mhz) 7.1 ASTM D150
Volume Resistivity(Ω.cm) 10^12 ASTM D257
Flammability V-0 UL94

Thermal conductivity(W/m.K) 7.0±0.5 ASTM D5470
Purchase information

Standard size: T≤1.5mm,size=200*400mm; T>1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.

Product Performance