TP 200 Series thermal pad
TP200-S gap filler pad, is key when your thermal needs begin to changed from design enhancement to thermal requirement. At 2.0 W/mK, TP200-S begins to add that extra thermal punch many designs require to keep specifications within thermal design targets.
Product features:Soft and highly compliant, Naturally tacky, easing application
Typical applications:Networking and Telecommunications, IT: Notebooks, Tablets, Power Conversion
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Product Specifications
Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Grey Visual
Thickness(mm) 0.5~10.0 astm d374
Density(g/cc) 2.8 ASTM D792
Hardness(shore oo) 25 ASTM D2240
Elongation(%) >100 ASTM D412
Usage Temperature(℃) -40~150 --
Breakdown Voltage(Kv/mm) 6.0 ASTM D149
Dielectric Constant(@10Mhz) 7.0 ASTM D150
Volume Resistivity(Ω.cm) 10^13 ASTM D257
Flammability V-0 UL94
Thermal conductivity(W/m.K) 2.0 ASTM D5470
Purchase information

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.

Product Performance