TP 150 Series thermal pad
TP150-S is an extremely soft gap filler pad, specifically designed to many design needs. With a shore hardness of 40 (Shore 00) and thermal conductivity of 1.5 W/ mK, TP 150-S provides that added thermal performance that lower thermal pads cannot meet without sacrificing hardness or contact resistance.
Product features:Soft and highly compliant, Naturally tacky, easing application
Typical applications:Networking and Telecommunications
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Product Specifications
Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Light Grey Visual
Thickness(mm) 1.0~10.0 ASTM d374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 40±5 ASTM D2240
Usage Temperature(℃) -40~150 --
Breakdown Voltage(Kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@1MHz) 6.66 ASTM D150
Volume Resistivity(Ω.cm) 10^13 ASTM D257
Flammability V-0 UL94
Thermal conductivity(W/m.K) 1.5±0.1 ASTM D5470
Purchase information

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
Product Performance