TP 500 Series thermal pad
TP 500 is a 5W/mK thermal gap filler, in the TP line of products. With high conductivity combined with a hardness of 50 (shore 00), TP 500 is excellent for applications requiring low contact resistance, low pressure vs. deflection, and low thermal resistance. TP 500 will provide the overall performance required.
Product features:Elevated Performance Gap Filler Pad, Thermal conductivity: 5.0 W/m.k
Typical applications:Networking and Telecommunications, IT: BGA, ASIC, VRM, high speed storage
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Product Specifications
Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Dark green Visual
Thickness(mm) 1.0~6.0 ASTM D374
Density(g/cc) 3.2±0.1 ASTM D792
Hardness(shore oo) 50±5 ASTM D2240
Usage Temperature(℃) -40~200 --
Breakdown Voltage(kv/mm) ≥6.0 ASTM D149
Dielectric Constant(@10mhz) 7.4 ASTM D150
Volume Resistivity(Ω.cm) 10^10 ASTM D257
Flammability V-0 UL94

Thermal conductivity(W/m.K) 5.0±0.3 ASTM D5470
Purchase information

Standard size: T≤1.5mm,size=200*400mm; T>1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.

Product Performance