TP 120 Series thermal pad
TP 120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse. With a shore hardness of 20 (00), and thermal conductivity of 1.2 W/ mK, TP 120 will not overstress applications and provide low contact resistance even in the most varying of applications.
Product features：Good thermal conductivity, Extremely soft and cost effective
Typical applications：Networking and Telecommunications. IT: Notebooks, Tablets, Power Conversion
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Typical applications：Networking and Telecommunications. IT: Notebooks, Tablets, Power Conversion
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Product feature• Thermal Conductivity：1.2W/mK
• Ultra soft and highly compliant
• Naturally tacky, easing application
• Low pressure versus deflection
• Excellent, high volume applications -
Typical applications• Networking and Telecommunications
• IT: Notebooks, Tablets, Power Conversion
• Industrial: LEDs, Power Supplies and Conversion
• Automotive: Control Modules, Turbo Actuators
• Consumer Electronics: Gaming Systems, and LCDs
Product Specifications
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | Pink | Visual |
| Thickness (mm) | 0.5~10.0 | ASTM d374 |
| Density (g/cc) | 2.3 | ASTM D792 |
| Hardness (Shore OO) | 20 | ASTM D2240 |
| Tensile Strength（kn/m） | 0.4 | ASTM D624 |
| Elongation % | 52 | ASTM D412 |
| Usage Temperature（℃） | -40~150 | - |
| Electrical |
|
|
| Breakdown Voltage（kv/mm） | ≥6.0 | ASTM D149 |
| Dielectric Constant（@1mhz） | 3.9 | ASTM D150 |
| Volume Resistivity（Ω.cm） | 1.0*10^12 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity（W/m.K） | 1.2 | ASTM D5470 |
Purchase information
Product Performance
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