TP 120 Series thermal pad
TP 120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse. With a shore hardness of 20 (00), and thermal conductivity of 1.2 W/ mK, TP 120 will not overstress applications and provide low contact resistance even in the most varying of applications.
Product features：Good thermal conductivity, Extremely soft and cost effective
Typical applications：Networking and Telecommunications. IT: Notebooks, Tablets, Power Conversion
Contact us for samples
Typical applications：Networking and Telecommunications. IT: Notebooks, Tablets, Power Conversion
-
Product feature• Thermal Conductivity：1.2W/mK
• Ultra soft and highly compliant
• Naturally tacky, easing application
• Low pressure versus deflection
• Excellent, high volume applications -
Typical applications• Networking and Telecommunications
• IT: Notebooks, Tablets, Power Conversion
• Industrial: LEDs, Power Supplies and Conversion
• Automotive: Control Modules, Turbo Actuators
• Consumer Electronics: Gaming Systems, and LCDs
Product Specifications
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | Pink | Visual |
| Thickness (mm) | 0.5~12.0 | ASTM d374 |
| Density (g/cc) | 2.3 | ASTM D792 |
| Hardness (Shore OO) | 20±5 | ASTM D2240 |
| Tensile Strength（kn/m） | 0.4 | ASTM D624 |
| Elongation % | 52 | ASTM D412 |
| Usage Temperature（℃） | -40~150 | - |
| Electrical |
|
|
| Breakdown Voltage（kv/mm） | ≥6.5 | ASTM D149 |
| Dielectric Constant（@1mhz） | 5.3 | ASTM D150 |
| Volume Resistivity（Ω.cm） | 1.0*10^12 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity（W/m.K） | 1.2±0.1 | ASTM D5470 |
Purchase information
Product Performance
Related products
UTP 100 Series thermal pad
UTP 100 is an extremely soft gap filler pad with a fiberglass reinforced liner, on one side .
Learn More
TP 120 Series thermal pad
TP 120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse.
Learn More
TP 150 Series thermal pad
TP150-S is an extremely soft gap filler pad, specifically designed to many design needs.
Learn More
TP 200 Series thermal pad
TP200-S gap filler pad, is key when your thermal needs begin to changed from design enhancement to thermal requirement.
Learn More
TP 300 Series thermal pad
TP 300 an extremely soft gap filler pad that also harnesses exceptional thermally conductive characteristics.
Learn More
TP 400 Series thermal pad
TP 400 elevates the thermal performance bar, achieving 4 W/ mK while maintaining a hardness of 55 (shore 00).
Learn More