TP 120 Series thermal pad
TP 120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse. With a shore hardness of 20 (00), and thermal conductivity of 1.2 W/ mK, TP 120 will not overstress applications and provide low contact resistance even in the most varying of applications.
Product features:Good thermal conductivity, Extremely soft and cost effective
Typical applications:Networking and Telecommunications. IT: Notebooks, Tablets, Power Conversion
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Typical applications:Networking and Telecommunications. IT: Notebooks, Tablets, Power Conversion
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Product feature• Thermal Conductivity:1.2W/mK
• Ultra soft and highly compliant
• Naturally tacky, easing application
• Low pressure versus deflection
• Excellent, high volume applications -
Typical applications• Networking and Telecommunications
• IT: Notebooks, Tablets, Power Conversion
• Industrial: LEDs, Power Supplies and Conversion
• Automotive: Control Modules, Turbo Actuators
• Consumer Electronics: Gaming Systems, and LCDs
Product Specifications
Attribute | Value | Test Method |
---|---|---|
Composition | Ceramic Filler + Silicone | - |
Color | Pink | Visual |
Thickness (mm) | 0.5~12.0 | ASTM d374 |
Density (g/cc) | 2.3 | ASTM D792 |
Hardness (Shore OO) | 20±5 | ASTM D2240 |
Tensile Strength(kn/m) | 0.4 | ASTM D624 |
Elongation % | 52 | ASTM D412 |
Usage Temperature(℃) | -40~150 | - |
Electrical |
|
|
Breakdown Voltage(kv/mm) | ≥6.5 | ASTM D149 |
Dielectric Constant(@1mhz) | 5.3 | ASTM D150 |
Volume Resistivity(Ω.cm) | 1.0*10^12 | ASTM D257 |
Flammability | V-0 | UL94 |
Thermal | ||
Thermal conductivity(W/m.K) | 1.2±0.1 | ASTM D5470 |
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Product Performance

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