TP 300 Series thermal pad
TP 300 an extremely soft gap filler pad that also harnesses exceptional thermally conductive characteristics. TP 300 can meet the design needs of numerous design requirements and specifications. TP 300 will provide the innate thermal requirements your design needs without over stressing the components or cases.
Product features:Soft and highly compliant, Naturally tacky, easing application
Typical applications:Industrial: LEDs, Power Supplies and Conversion
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Product Specifications
Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Light Blue Visual
Thickness(mm) 0.3~10.0 ASTM d374
Density(g/cc) 3.0 ASTM D792
Hardness(shore oo) 40 ASTM D2240
Usage Temperature(℃) -40~150 --
Breakdown Voltage(kv/mm) ≥6.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 10^13 ASTM D257
Flammability V-0 UL94

Thermal conductivity(W/m.K) 3.0 ASTM D5470
Purchase information

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

Product Performance