TP 300 Series thermal pad
TP 300 an extremely soft gap filler pad that also harnesses exceptional thermally conductive characteristics. TP 300 can meet the design needs of numerous design requirements and specifications. TP 300 will provide the innate thermal requirements your design needs without over stressing the components or cases.
Product features：Soft and highly compliant, Naturally tacky, easing application
Typical applications：Industrial: LEDs, Power Supplies and Conversion
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Typical applications：Industrial: LEDs, Power Supplies and Conversion
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Product feature■ Thermal conductivity: 3.0W/mK
■ Soft and highly compliant
■ Naturally tacky, easing application
■ Low pressure versus deflection
■ Excellent, high volume applications
■ Elevated Temperature Resistance -
Typical applications■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ Industrial: LEDs, Power Supplies and Conversion
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCDs, and Graphic Cards
Product Specifications
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | Light Blue | Visual |
| Thickness（mm） | 0.3~10.0 | ASTM d374 |
| Density（g/cc） | 3.0 | ASTM D792 |
| Hardness（shore oo） | 40 | ASTM D2240 |
| Usage Temperature（℃） | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage（kv/mm） | ≥6.0 | ASTM D149 |
| Dielectric Constant（@10mhz） | 7.3 | ASTM D150 |
| Volume Resistivity（Ω.cm） | 10^13 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal |
|
|
| Thermal conductivity（W/m.K） | 3.0 | ASTM D5470 |
Purchase information
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
Product Performance
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