TP 600 Series thermal pad
TP600 Series thermal pad is a material with high thermal conductivity. It is self-adhesive on both sides. When used with electronic components, it exhibits lower thermal resistance and better electrical insulation characteristics under low compression. It can work stably at -40℃~150℃ and meet the flame retardant requirements of UL94V0.
Product features:Thermal conductivity:6.0W/mK,High conformability,Electrically insulating,Easy to assembly
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
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Product Specifications
Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Orange Visual
Thickness(mm) 0.5~10.0 astm d374
Density(g/cc) 3.285 ASTM D792
Hardness(shore oo) 40±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Breakdown Voltage(kv/mm) >5.0 ASTM D149
Dielectric Constant(@10mhz) 7.9 ASTM D150
Volume Resistivity(Ω.cm) 10^12 ASTM D257
Flammability V-0 UL94

Thermal conductivity(W/m.K) 6.0±0.5 ASTM D5470
Purchase information

Standard size: T≤1.5mm,size=200*400mm; T>1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.

Product Performance