UTP 100 Series thermal conductive pad

Thermal Interface Materials - High Performance Thermally Conductive gap filler pads from AOK^TM China. Ultra High Thermally Conductive Pads with Exceptional Dielectric Strength.

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Features

UTP 100 Series thermal conductive pad Key Features

-Fiberglass Reinforcement and Good thermal conductivity
-High conformability and cost effective
-Extremely soft and Naturally tacky on unreinforced side
-High dielectric strength of >6,000 volts AC

Applications

UTP 100 Series thermal conductive pad Applications

- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Product Parameter

Typical Properties of UTP100
Properties	Units	UTP100	Test Method
Construction & Composition	---	Silicone & Ceramic filled	---
Color	---	pink & white	Visual
Thickness Range	mm	0.5~6.0	---
Hardness	Shore C	10	ASTM D2240
Density	g/cc	2.0	ASTM D792
Tensile Strength	KN/m	2.5	ASTM D412
Elongation	%	60%	ASTM D412
Continuous Use Temp	℃	-40 to 150	EN344
Breakdown Voltage	Kv/mm	≥6.0	ASTM D149
Volume Impedance	ohm-cm	6.2*10¹⁵	ASTM D257
Dielectric Constant	1MHz	5.27	ASTM D150
Weight Daminify	---	≤1﹪	@150℃ 240H
Flame Rating	---	V-0	UL 94
Thermal Conductivity	W/m.k	1.0	ASTM D5470
UL, RoHS, REACH	---	Compliance	---