UTP 100 Series thermal conductive pad Key Features
-Fiberglass Reinforcement and Good thermal conductivity
-High conformability and cost effective
-Extremely soft and Naturally tacky on unreinforced side
-High dielectric strength of >6,000 volts AC
UTP 100 Series thermal conductive pad Applications
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.