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UTP 100 Series thermal conductive pad

  • UTP 100 Series thermal conductive pad
  • UTP 100 Series thermal conductive pad

Thermal Interface Materials - High Performance Thermally Conductive gap filler pads from AOKTM China. Ultra High Thermally Conductive Pads with Exceptional Dielectric Strength.

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UTP 100 Series thermal conductive pad


UTP 100 Series thermal conductive pad Key Features

-Fiberglass Reinforcement and Good thermal conductivity
-High conformability and cost effective
-Extremely soft and Naturally tacky on unreinforced side
-High dielectric strength of >6,000 volts AC


UTP 100 Series thermal conductive pad Applications

- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Product Parameter

Typical Properties of UTP100
Properties Units UTP100 Test Method
Construction & Composition --- Silicone & Ceramic filled ---
Color --- pink & white Visual
Thickness Range mm 0.5~6.0 ---
Hardness Shore C 10 ASTM D2240
Density g/cc 2.0 ASTM D792
Tensile Strength KN/m 2.5 ASTM D412
Elongation % 60% ASTM D412
Continuous Use Temp -40 to 150 EN344
Breakdown Voltage Kv/mm ≥6.0 ASTM D149
Volume Impedance ohm-cm 6.2*1015 ASTM D257
Dielectric Constant 1MHz 5.27 ASTM D150
Weight Daminify --- ≤1﹪ @150℃ 240H
Flame Rating --- V-0 UL 94
Thermal Conductivity W/m.k 1.0 ASTM D5470
UL, RoHS, REACH --- Compliance ---
Low-hardness that makes for good compressibility and a stress-relaxation property and processibility; Excellent workability and processibility
Sheet sizes:
Standard sheet size:200*400mm;Custom Die-cut parts available;Available with or without PSA on reinforced side


pdf UTP 100 Series thermal conductive pad

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