TP 700 Series thermal conductive pad Key Features
-Thermal Conductivity: 7.0 W/m.k
-Easy to assembly
TP 700 Series thermal conductive pad Applications
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.