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TP 700 Series thermal conductive pad

  • TP 700 Series thermal conductive pad
  • TP 700 Series thermal conductive pad

Thermal pads are used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.


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TP 700 Series thermal conductive pad

Features

TP 700 Series thermal conductive pad Key Features

-Thermal Conductivity: 7.0 W/m.k
-High conformability
-Electrically insulating
-Easy to assembly

Applications

TP 700 Series thermal conductive pad Applications

- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Product Parameter

Properties of TP700
Properties Units TP700 Test Method
Construction & Composition --- Silicone & Ceramic filled ---
Color --- Light blue Visual
Thickness Range mm 1.0~10.0 ASTM D374
Hardness Shore C 35±5 ASTM D2240
Density g/cc 3.3 ASTM D792
Thermal Resistance ℃-in2/W 0.13 ASTM D5470
Specifications mm 200×400 ASTM D1204
Continuous Use Temp -40 ~150 EN344
Breakdown Voltage Kv/mm >6.0 ASTM D149
Volume Impedance Ω.cm ASTM D257
Dielectric Constant 1MHz 7.1 ASTM D150
Weight Daminify % ≤ 1.0 @125℃ 240H
Flame Rating --- V-0 UL 94
Thermal Conductivity W/m.k 7.0 ISO 22007-2
UL, RoHS, REACH --- Compliance ---

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PDF TP 700 Series thermal conductive pad


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