TP 080 Series thermal conductive pad Key Features
-Good thermal conductivity
-High conformability and cost effective
-Shock absorbing and naturally tacky
-it is easy to fill in air gaps between PC board and heat sinks or a metal chassis
TP 080 Series thermal conductive pad Applications
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.