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  • Thermal Pad
  • Thermal Pad

Thermal Interface Materials - High Performance Thermally Conductive gap filler pads from AOKTM China. Ultra High Thermally Conductive Pads with Exceptional Dielectric Strength.


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Features

AOK Thermal Pad Key Features

Soft with high compressibility to reduce thermal resistance and enhance thermal conductivity Optional thermal conductivities for your cooling applications Naturally sticky Cost effective solutions with competitive price

Thermal Pad

Advantages

All thermally conductive interface gap filler family products are thermal interface materials, which are used to fill in air gaps between heat-generating electronic device and heatsinks or metal housing or chassis for intimate contact over rough or uneven surface textures to eliminate air gaps and reduce thermal resistance with high conformability.


Compared to common thermal conductive & insulating materials, TP series has certain stickiness which bring great convenience in the product installation processing, not easy to fall off and easy to operate. These products are capable of close conformity to irregular or complex surfaces.

Applications

AOK Thermal Pad Applications

- Between electronic components such as semiconductor, IC, CPU.MOS and heatsink.

- Cooling Module, Thermal Module, in all applications where a metal housing is used as heatsink.

- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc


Aochuan Technology offers many other thermal interface materials that may not be shown on our web site. Please go to Contact Form to receive a recommendation from our office on your specific application.

Downloads:


PDF Thermally Conductive Gap Filler Products Line


Online Enquiry

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Contact us

Office Add: Room A309, Shennan Garden, Nanshan District, Shenzhen, China. PC:518000

Tel: +86-755-8652 1770

E-mail: sales@aok-technologies.com

Fax: +86-755-8652 1449

For product information and pricing, chat with sales agent

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E-mail:sales@aok-technologies.com