AOK Thermal Conductive Sealant Features
TJ600 Thermal Conductive Pouring Sealant is a material in LOW viscosity anci composed of double components with excellent fluidity and stability. it could be consolidated in room temperature or by heating, TJ600 has a character in speedy consolidation through rising temperature, with no extra by-product occur during the consolidation process. It is in widely application on the surface of PC,ABS,PP,PVC with metal materials, also suitable for the requirement of good thermal conductivity, highly electrical isolation, anti-water and flame retardant characteristics for electronic components, which also is qualified with EU ROHS Directive.
Thermal Conductive Sealant
Silicone adhesive or conducive sealant makes excellent conductive material through the addition of advanced fillers. It offers superior heat dissipation for various electronic applications. They are also used to improve conduction of heat in sensors, radiators and other thermal devices.
We at AOK Technologies introduce a range of high thermally conductive materials for specialist electronic applications. The nature of the produces can effectively reduces air gaps thereby, increases the effective dissipation of heat when compared to other preformed materials of this kind. As superior grade materials, thermal conductive sealants from AOK Technologies are consistently reliable at high temperatures.
AOK Thermal Conductive Sealant Main Characteristics
1. In exceptional fluidity with spontaneous levelling after mixing the A＆B components
2. In splendid electrical isolation, anti-moisture, non-contraction with remarkable stability.
3. It has no contraction and temperature rising phenomenon during the consolidation process.
4. It is in elastomer character after consolidation procedure, with excellent anti-thixotropy between the cold and hot condition, also in remarkable aging endurance performance.
AOK Thermal Conductive Sealant Applications
In pouring sealant for LED display, power module and miscellaneous electronic devices.