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TP 600 Series thermal conductive pad

  • TP 600 Series thermal conductive pad
  • TP 600 Series thermal conductive pad

Silicone-based thermal pads are becoming an industry standard for thermal management solutions for their durability to withstand high temperatures up to 200°C. AOK offers a wide variety from 1.0 W/m*K up to 5.0 W/m*K. While some may be concerned with the use of silicone, outgas levels are extremely low. They come with the options of two sides self-tacky and one side self-tacky. Thickness are flexible ranging from 0.5mm and up.


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TP 600 Series thermal conductive pad

Features

TP 600 Series thermal conductive pad Key Features

-Thermal Conductivity: 6.0 W/m.k
-High conformability
-Electrically insulating
-Easy to assembly

Applications

TP 600 Series thermal conductive pad Applications

Thermal pads are used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.

- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Product Parameter

Properties of TP600
Properties Units TP600 Test Method
Construction & Composition --- Silicone & Ceramic filled ---
Color --- orange Visual
Thickness Range mm 1.0~10.0 ASTM D374
Hardness Shore C 50±5 ASTM D2240
Density g/cc 3.285 ASTM D792
Thermal Resistance ℃-in2/W 0.138 ASTM D5470
Elongation % 80% ASTM D412
Continuous Use Temp -40 to 150 EN344
Breakdown Voltage Kv/mm >5.0 ASTM D149
Volume Impedance Ω.cm 1012 ASTM D257
Dielectric Constant 1MHz 7.9 ASTM D150
Weight Daminify % ≤ 1.0 @125℃ 240H
Flame Rating --- V-0 UL 94
Thermal Conductivity W/m.k 6.0 ISO 22007-2
UL, RoHS, REACH --- Compliance ---

Downloads:


PDF TP 600 Series thermal conductive pad


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