TP 300 Series thermal conductive pad Key Features
-High thermal conductivity
-High conformability and cost effective
-Naturally tacky requiring no additional adhesive coating
TP 300 Series thermal conductive pad Applications
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.