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TP 250 Series thermal conductive pad

  • TP 250 Series thermal conductive pad
  • TP 250 Series thermal conductive pad

TP 250 Series Thermal Gap Filler is naturally tacky, requiring no adhesive coating to inhabit thermal performance, It can also be with a rubber-coated fiberglass carrier becoming one side tacky and no tacky on other side to allowing easy material handing and installation.


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TP 250 Series thermal conductive pad

Features

TP 250 Series thermal conductive pad Key Features

-High thermal conductivity
-High conformability and cost effective
-Naturally tacky needing no additional adhesive coating
-Electrically insulating

Applications

TP 250 Series thermal conductive pad Applications

- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Product Parameter

Typical Properties of TP250
Properties Units TP250 Test Method
Construction & Composition --- Silicone & Ceramic filled ---
Color --- Light Yellow Visual
Thickness Range mm 0.5~5.0 ---
Hardness Shore C 25 ASTM D2240
Density g/cc 2.93 ASTM D792
Tensile Strength KN/m 0.4 ASTM D412
Elongation % 72% ASTM D412
Continuous Use Temp -40 to 150 EN344
Breakdown Voltage Kv/mm ≥5.0 ASTM D149
Volume Impedance ohm-cm 3.2*1016 ASTM D257
Dielectric Constant 1MHz 6.3 ASTM D150
Weight Daminify --- ≤0.5﹪ @150℃ 240H
Flame Rating --- V-0 UL 94
Thermal Conductivity W/m.k 2.5 ASTM D5470
UL, RoHS, REACH --- Compliance ---
Sheet sizes:
Standard sheet size:200*400mm;Custom Die-cut parts available;Available with or without PSA on reinforced side

Downloads:


PDF TP 250 Series thermal conductive pad


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