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TP 150 Series thermal conductive pad

  • TP 150 Series thermal conductive pad
  • TP 150 Series thermal conductive pad

TP 150 Series Thermal Gap Filler is naturally tacky, requiring no adhesive coating to inhabit thermal performance, It can also be with a rubber-coated fiberglass carrier becoming one side tacky and no tacky on other side to allowing easy material handing and installation.

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TP 150 Series thermal conductive pad


TP 150 Series thermal conductive pad Key Features

-Medium thermal conductivity
-High conformability and cost effective
-Naturally tacky
-Electrically insulating


TP 150 Series thermal conductive pad Applications

- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Product Parameter

Typical Properties of TP150
Properties Units TP150 Test Method
Construction & Composition --- Silicone & Ceramic filled ---
Color --- Dark Gray Visual
Thickness Range mm 0.5~12.0 ---
Hardness Shore C 25 ASTM D2240
Density g/cc 2.5 ASTM D792
Tensile Strength KN/m 0.5 ASTM D412
Elongation % 70% ASTM D412
Continuous Use Temp -40 to 150 EN344
Breakdown Voltage Kv/mm ≥5.0 ASTM D149
Volume Impedance ohm-cm 8.0*1015 ASTM D257
Dielectric Constant 1MHz 5.75 ASTM D150
Weight Daminify --- ≤0.3﹪ @150℃ 240H
Flame Rating --- V-0 UL 94
Thermal Conductivity W/m.k 1.5 ASTM D5470
UL, RoHS, REACH --- Compliance ---
Sheet sizes:
Standard sheet size:200*400mm;Custom Die-cut parts available;Available with or without PSA on reinforced side


PDF TP 150 Series thermal conductive pad

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