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| Thermally Conductive Gap Filler product Line |
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All thermally conductive Gap Filler family products are thermal interface materials, which are used to fill in air gaps between heat-generating electronic device and heatsinks or metal housing or chassis for intimate contact over rough or uneven surface textures to eliminate air gaps and reduce thermal resistance with high conformability. |
Features
Soft with high compressibility to reduce thermal resistance and enhance thermal conductivity Optional thermal conductivities for your cooling applications Naturally sticky Cost effective solutions with competitive price
Applications
- Between electronic components such as semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal Module, in all applications where a metal housing is used as heatsink.
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Thermally Conductive Gap Filler